Lead-Free Solder Joint Reliability by Dr. Jean-Paul Clech Join us for our next webinar! June 6, 2018 8:30 am -12:00 pm Pacific time (California) Cost $350 per person Group discounts available! Register here and pass on to your co-workers! Given the proliferation of lead-free solder alloys, and the dearth of lead-free reliability data and modeling […]

Lead-Free Solder Joint Reliability by Dr. Jean-Paul Clech Join us for our next webinar! June 6, 2018 8:30 am -12:00 pm Pacific time (California) Cost $350 per person Group discounts available! Register here and pass on to your co-workers! Given the proliferation of lead-free solder alloys, and the dearth of lead-free reliability data and modeling […]

Lead-Free Solder Joint Reliability by Dr. Jean-Paul Clech Join us for our next webinar! June 6, 2018 8:30 am -12:00 pm Pacific time (California) Cost $350 per person Group discounts available! Register here and pass on to your co-workers! Given the proliferation of lead-free solder alloys, and the dearth of lead-free reliability data and modeling […]

Microelectronic Packaging Issues and Failure Analysis by Thomas Green Join us for a webinar on June 20, 2018 8:30-11:30 AM Pacific time (California) Cost $300 per person, Group discounts available! Register here and pass this on to your co-workers! The design and packaging of microelectronic devices such as hybrids, RF and microwave modules, Class III […]

Microelectronic Packaging Issues and Failure Analysis by Thomas Green Join us for a webinar on June 20, 2018 8:30-11:30 AM Pacific time (California) Cost $300 per person, Group discounts available! Register here and pass this on to your co-workers! The design and packaging of microelectronic devices such as hybrids, RF and microwave modules, Class III […]

Microelectronic Packaging Issues and Failure Analysis by Thomas Green Join us for a webinar on June 20, 2018 8:30-11:30 AM Pacific time (California) Cost $300 per person, Group discounts available! Register here and pass this on to your co-workers! The design and packaging of microelectronic devices such as hybrids, RF and microwave modules, Class III […]