ESPEC North America and the Qualmark Product line will be co-exhibiting with ESPEC Europe at Auto Test Expo in Stuttgart, Germany – June 5-7 Stand: 1612 Stop by and say hello! http://www.testing-expo.com/europe/en/ Automotive Testing Expo Europe will once again run at the Messe Stuttgart and will feature record numbers of exhibitors. Over 400 exhibiting companies […]
Lead-Free Solder Joint Reliability by Dr. Jean-Paul Clech Join us for our next webinar! June 6, 2018 8:30 am -12:00 pm Pacific time (California) Cost $350 per person Group discounts available! Register here and pass on to your co-workers! Given the proliferation of lead-free solder alloys, and the dearth of lead-free reliability data and modeling […]
Lead-Free Solder Joint Reliability by Dr. Jean-Paul Clech Join us for our next webinar! June 6, 2018 8:30 am -12:00 pm Pacific time (California) Cost $350 per person Group discounts available! Register here and pass on to your co-workers! Given the proliferation of lead-free solder alloys, and the dearth of lead-free reliability data and modeling […]
Lead-Free Solder Joint Reliability by Dr. Jean-Paul Clech Join us for our next webinar! June 6, 2018 8:30 am -12:00 pm Pacific time (California) Cost $350 per person Group discounts available! Register here and pass on to your co-workers! Given the proliferation of lead-free solder alloys, and the dearth of lead-free reliability data and modeling […]
Lead-Free Solder Joint Reliability by Dr. Jean-Paul Clech Join us for our next webinar! June 6, 2018 8:30 am -12:00 pm Pacific time (California) Cost $350 per person Group discounts available! Register here and pass on to your co-workers! Given the proliferation of lead-free solder alloys, and the dearth of lead-free reliability data and modeling […]
Microelectronic Packaging Issues and Failure Analysis by Thomas Green Join us for a webinar on June 20, 2018 8:30-11:30 AM Pacific time (California) Cost $300 per person, Group discounts available! Register here and pass this on to your co-workers! The design and packaging of microelectronic devices such as hybrids, RF and microwave modules, Class III […]
Microelectronic Packaging Issues and Failure Analysis by Thomas Green Join us for a webinar on June 20, 2018 8:30-11:30 AM Pacific time (California) Cost $300 per person, Group discounts available! Register here and pass this on to your co-workers! The design and packaging of microelectronic devices such as hybrids, RF and microwave modules, Class III […]
Microelectronic Packaging Issues and Failure Analysis by Thomas Green Join us for a webinar on June 20, 2018 8:30-11:30 AM Pacific time (California) Cost $300 per person, Group discounts available! Register here and pass this on to your co-workers! The design and packaging of microelectronic devices such as hybrids, RF and microwave modules, Class III […]
Microelectronic Packaging Issues and Failure Analysis by Thomas Green Join us for a webinar on June 20, 2018 8:30-11:30 AM Pacific time (California) Cost $300 per person, Group discounts available! Register here and pass this on to your co-workers! The design and packaging of microelectronic devices such as hybrids, RF and microwave modules, Class III […]
We will be closed today in observance of Independence Day. Have a safe and relaxing holiday! We hope you enjoy the time with family and friends! Your Reliability Training Team at Hobbs Engineering