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Webinar: Microelectronic Packaging Issues and Failure Analysis by Thomas Green

June 20, 2018 @ 8:30 am - 11:30 am

$300

Microelectronic Packaging Issues and Failure Analysis by Thomas Green

Join us for a webinar on June 20, 2018 8:30-11:30 AM Pacific time (California) Cost $300 per person, Group discounts available!

Register here and pass this on to your co-workers!

The design and packaging of microelectronic devices such as hybrids, RF and microwave modules, Class III medical implants, and other types of packaged microcircuits intended for high reliability systems is a critical aspect of reliability engineering.  This 3 hour webinar, which costs $300, is intended to review and highlight the typical kinds of microelectronic packaging related failures that occur during manufacturing, qualification, and unfortunately in the field, and present the Failure Analysis (FA) tools and techniques that are utilized to understand root cause and guide corrective actions.

The instructor shares his years of experience directing microelectronic packaging related root cause FA investigations.  Mismatched CTEs and poorly designed package geometries often lead to mechanical failure at the die and substrate interface or cracking at the heel of a wire or ribbon bond interconnect.  Careful de-lid, visual inspection followed by SEM and EDAX/Auger are required to identify root cause.  Reliability engineers must be cognizant of the full range of FA tools available to diagnose failures and, resist the temptation to rush to judgment, which often happens destroying valuable evidence along the way.  The instructor will review real world specific examples of packaging failures and resultant FA analysis and problem resolution.

This intermediate course is intended for reliability engineers, design, quality, and process engineers plus responsible mid-level managers.

Instructor Biography:

Mr. Thomas Green is the principle at TJ Green Associates LLC (www.tjgreenllc.com), a veteran owned small business focused on training and consulting for military, space and medical microelectronic devices. He teaches a variety of microelectronics packaging courses around the globe and in plant at major corporations and consults for a variety of companies in the military/industrial and medical device industries. He has thirty five years of experience in microelectronics working at positions in industry, academia and government. Tom has demonstrated expertise in die attach, wirebond, visual inspection, failure analysis, hermetic seal and leak testing processes. Tom is an active IMAPS member and Society Fellow. He has a B.S. in Materials Engineering from Lehigh University and a Masters from the University of Utah.

Cost:$300 per person, if you have five or more from the same company the cost is $270 per person

 

 

Details

Date:
June 20, 2018
Time:
8:30 am - 11:30 am
Cost:
$300
Event Categories:
,
www.hobbsengr.com

Venue

Webinar

Organizer

Sharon Cary
Phone:
303/655-3051
Email:
learn@hobbsengr.com
View Organizer Website