Lead-Free Solder Joint Reliability by Dr. Jean-Paul Clech Join us for our next webinar! June 6, 2018 8:30 am -12:00 pm Pacific time (California) Cost $350 per person Group discounts available! Register here and pass on to your co-workers! Given the proliferation of lead-free solder alloys, and the dearth of lead-free reliability data and modeling […]
Lead-Free Solder Joint Reliability by Dr. Jean-Paul Clech Join us for our next webinar! June 6, 2018 8:30 am -12:00 pm Pacific time (California) Cost $350 per person Group discounts available! Register here and pass on to your co-workers! Given the proliferation of lead-free solder alloys, and the dearth of lead-free reliability data and modeling […]
Lead-Free Solder Joint Reliability by Dr. Jean-Paul Clech Join us for our next webinar! June 6, 2018 8:30 am -12:00 pm Pacific time (California) Cost $350 per person Group discounts available! Register here and pass on to your co-workers! Given the proliferation of lead-free solder alloys, and the dearth of lead-free reliability data and modeling […]
Microelectronic Packaging Issues and Failure Analysis by Thomas Green Join us for a webinar on June 20, 2018 8:30-11:30 AM Pacific time (California) Cost $300 per person, Group discounts available! Register here and pass this on to your co-workers! The design and packaging of microelectronic devices such as hybrids, RF and microwave modules, Class III […]
Microelectronic Packaging Issues and Failure Analysis by Thomas Green Join us for a webinar on June 20, 2018 8:30-11:30 AM Pacific time (California) Cost $300 per person, Group discounts available! Register here and pass this on to your co-workers! The design and packaging of microelectronic devices such as hybrids, RF and microwave modules, Class III […]
Microelectronic Packaging Issues and Failure Analysis by Thomas Green Join us for a webinar on June 20, 2018 8:30-11:30 AM Pacific time (California) Cost $300 per person, Group discounts available! Register here and pass this on to your co-workers! The design and packaging of microelectronic devices such as hybrids, RF and microwave modules, Class III […]
Microelectronic Packaging Issues and Failure Analysis by Thomas Green Join us for a webinar on June 20, 2018 8:30-11:30 AM Pacific time (California) Cost $300 per person, Group discounts available! Register here and pass this on to your co-workers! The design and packaging of microelectronic devices such as hybrids, RF and microwave modules, Class III […]
We will be closed today in observance of Independence Day. Have a safe and relaxing holiday! We hope you enjoy the time with family and friends! Your Reliability Training Team at Hobbs Engineering
We will be closed today in observance of Independence Day. Have a safe and relaxing holiday! We hope you enjoy the time with family and friends! Your Reliability Training Team at Hobbs Engineering
We will be closed today in observance of Independence Day. Have a safe and relaxing holiday! We hope you enjoy the time with family and friends! Your Reliability Training Team at Hobbs Engineering