Webinar: Microelectronic Packaging Issues and Failure Analysis by Thomas Green
Microelectronic Packaging Issues and Failure Analysis by Thomas Green Join us for a webinar on June 20, 2018 8:30-11:30 AM Pacific time (California) Cost $300 per person, Group discounts available! Register here and pass this on to your co-workers! The design and packaging of microelectronic devices such as hybrids, RF and microwave modules, Class III […]