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Webinar: Physics of Failure Tools, Mechanisms, Modeling, and New Methods by Dr. Alec Feinberg

October 17, 2017 @ 8:30 am - 12:30 pm

$400

Physics of Failure Tools, Mechanisms, Modeling, and New Methods (including Advanced Methods with FDS, Mesoscopic Measurement & Maximum Work Technique for life predictions) by Dr. Alec Feinberg

Join us for a NEW webinar on Tuesday October 17, 2017, at 8:30 – 12:30 pm PDT (California)

Cost $400 per person, group discounts available!

Register here!

There are many aspects to the science of Physics of Failure. In this course we approach the subject by dividing it up into four main sections:

  • Tools
  • Mechanisms
  • Modeling
  • And Measurement Techniques

This course is an in depth approach to physics of failure.  It is designed for the engineer who wants a good knowledge base including the state-of-the-art in this area.  The following outline provides an overview for each section.

Physics of Failure Tools

  • SEM (FE-SEM, EDS)
  • Digital Microscopy
  • Focused Ion Beam
  • Real Time Radiology, X-Ray Maps
  • C-SAM
  • Thermal Imaging
  • FTIR
  • Scanning Auger
  • Atomic Force Microscopy
  • SIMS
  • Other Tools Including ESD Simulator
  • Sample Preparations

Physics of Failure Mechanisms

  • Diffusion – Substitutional, Kirkendall
  • Intermetallics – Au Embrittlement, Purple Plague
  • Bond wire failures – non stick, intermetallic
  • Eight Types of Corrosion – Area effect, and Prevention
  • Dendritic Growth, Ag Migration & Electromigration
  • Modes of Mechanical Failure
  • Fatigue Failure
  • Wear
  • Stress-Strain – Yielding, Vibration,
  • CTE’s Mismatch, Thermal Fatigue
  • Electronic Failure modes from shock, vibration
  • Creep, Solder Creep, Creep Resistance in Plastics
  • Organic contamination
  • Popcorn Cracking, Voiding Delamination
  • Assembly Errors
  • Solder Failures (non wetting, grain size, leaching, coverage)
  • Contamination – Solder non-wetting, Epoxy non-stick
  • Plating Contamination
  • RoHS Lead Free Solder Issues
  • Cu Dissolution
  • BGA, Tin Whiskers
  • PCB Finishes
  • ESD & EOS – Dielectric Breakdown
  • Current Density & Fusing of Bond wires and wires
  • Junction Temperature Issues

Physics of Failure Modeling

  • Four main types of aging
  • Engelmaier IPC Solder Joint Life Model, BGAs
  • Junction Temperature Modeling
  • Circuit trace and wire bond current density limit modeling
  • Wear
  • Creep
  • Miner’ Fatigue Rule (Thermal, Mechanical, Combined)
  • Advances in S-N Curve Modeling
  • New Maximum Work Strength Modeling
  • Transistor FET & Beta Degradation

Physics of Failure Measurement Techniques

  • Fatigue Damage Spectrum (FDS)
  • New Mesoscopic Noise Measurements
  • Parametric Failure Rate Modeling

Instructor: Dr. Alec Feinberg is the founder of DfRSoft. He has a Ph.D. in Physics and is the principal author of the books, Design for Reliability (DfR) and Thermodynamic Degradation Science: Physics of Failure, Accelerated Testing, Fatigue, and Reliability Applications. These books are written in an industrial environment, and are very practical. Alec has a logical approach to the DfR processes using a stage gate method since products are develop in these phases. Alec uses this method in his reliability training classes as well found on the DfRSoft website. Alec is also the principal developer for DfRSoftware which is the most thorough reliability tool currently available and is also used to accelerate learning in his training classes. Alec’s industrial experience has allowed him to provide extensive reliability engineering services in diverse industries (AT&T Bell Labs, TASC, M/A-COM, Tyco Electronics, and Advanced Energy) for over 35 years on solar, thin film power electronics, defense, microelectronics, aerospace, wireless electronics, and automotive electrical systems. He has provided training classes in Design for Reliability & Quality, Shock and Vibration, HALT, Reliability Growth, and Electrostatic Discharge. Alec has presented numerous technical papers and won the 2003 RAMS Alan O. Plait best tutorial award for the topic, “Thermodynamic Reliability Engineering.”

For a printable course description, click here

 

Cost: $400 – If you have 5 or more the price is  $360 per person
Date: Wednesday, October 17, 2017
Time: 8:30 am – 12:30 pm Pacific time

After registering, you will receive a confirmation email containing information about joining the webinar. View System Requirements

Details

Date:
October 17, 2017
Time:
8:30 am - 12:30 pm
Cost:
$400
Event Categories:
,
Website:
http://www.hobbsengr.com

Venue

Webinar

Organizer

Sharon Cary
Phone:
303/655-3051
Email:
learn@hobbsengr.com
Website:
hobbsengr.com