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Webinar: Using Finite Element Analysis with Electronic Equipment: Thermal Cycling, Heat Transfer and Vibration Analysis by Steve Carlson

October 23 @ 8:30 am - 12:00 pm

$350

Using Finite Element Analysis with Electronic Equipment: Thermal Cycling, Heat Transfer and Vibration Analysis by Steve Carlson

Join us for our next webinar! October 23, 2024 8:30 AM-12:00 PM Pacific time (California) Cost $350 per person, Group discounts available! This course will be recorded and available for purchase to view at a time more convenient for you.  Contact us for more details.
Register here and pass this on to your co-workers!

This webinar expands on David Steinberg’s techniques and incorporates finite element analysis to determine electronic component junction temperatures and fatigue life due to random vibration and thermal cycling. This webinar is intended for beginners who have not yet had a course in finite element theory. The emphasis is on the engineering reasons to complete a valid finite element analysis. For completeness, it has been necessary to select specific software to illustrate the various stages. Most commercial solid modeling and finite element analysis systems are very similar, and the overlap in their capabilities is probably 90% or more. Solidworks has been selected due to its rapid learning curve and ability to perform most common finite element analysis for electronic hardware. Students will learn the stages of finite element analysis and work multiple examples with Solidworks Simulation and Cosmos/M Geostar. We will incorporate Professor Steinberg’s methods with FEA techniques to perform heat transfer, random vibration, and thermal cycling analyses. Questions are encouraged during the Webinar!

Who should attend: R&D Electronic Engineers and Managers • Packaging Engineers • Quality & Reliability Engineers • Test Engineers • Manufacturing Engineers • Mechanical Engineers • Application & Sale Engineers

2024 October 23 Using Finite Element Analysis by Steve Carlson for complete details, click here

Steve Carlson has over two decades of extensive experience in defense/aerospace industry dealing with design and analysis of electronic hardware with a strong understanding of thermal and structural analysis.  He is currently a Principal engineer at Jet Propulsion Laboratory leading a group of analysts in the Reliability and Mission Assurance section.  Steve learned the classical techniques for analyzing electronic hardware from Joel Sloan (author Design and Packaging of Electronic Equipment) and Dave Steinberg (author of multiple thermal and vibration analysis books) at Litton Guidance and Control Systems.  Steve has expanded the classical techniques to include modern solid modeling and Finite Element Analysis to reduce analysis time, improve accuracy, and decrease product development time.

After registering, you will receive a confirmation email containing information about joining the webinar.  NOTE if you do not receive the confirmation email, please call us at 303-655-3051
COST: $350 per person, $315 per person if you have five or more from the same company

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Details

Date:
October 23
Time:
8:30 am - 12:00 pm
Cost:
$350
Event Categories:
,
Website:
https://attendee.gotowebinar.com/register/4336671111109567072

Organizer

Sharon Cary
Phone
303/655-3051
Email
learn@hobbsengr.com
View Organizer Website