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Webinar: Using Finite Element Analysis with Electronic Equipment: Thermal Cycling, Heat Transfer and Vibration Analysis by Steve Carlson

January 18, 2023 @ 8:30 am - 12:00 pm

$350

Using Finite Element Analysis with Electronic Equipment: Thermal Cycling, Heat Transfer and Vibration Analysis by Steve Carlson

Join us for our next webinar! January 18, 2023 8:30 AM-12:00 PM Pacific time (California)
Cost $350 per person, Group discounts available! This course will be recorded and available for purchase to view at a time more convenient for you. Contact us for more details.

Register here and pass this on to your co-workers!

This 3.5-hour webinar, which costs $350, expands on David Steinberg’s techniques and incorporates finite element analysis to determine electronic component junction temperatures and fatigue life due to random vibration and thermal cycling. This webinar is intended for beginners who have not yet had a course in finite element theory. The emphasis is on the engineering reasons to complete a valid finite element analysis. For completeness, it has been necessary to select specific software to illustrate the various stages. Most commercial solid modeling and finite element analysis systems are very similar, and the overlap in their capabilities is probably 90% or more. Solidworks has been selected due to its rapid learning curve and ability to perform most common finite element analysis for electronic hardware. Students will learn the stages of finite element analysis and work multiple examples with Solidworks Simulation and Cosmos/M Geostar. We will incorporate Professor Steinberg’s methods with FEA techniques to perform heat transfer, random vibration, and thermal cycling analyses.

Steven Carlson has over 20 years of extensive experience in defense/aerospace industry dealing with design and analysis of electronic hardware with a strong understanding of thermal and structural analysis. He is a Principal Engineer in Electronic Hardware Thermal / Structural analysis at Jet Propulsion Laboratory. He has provided mechanical analysis consultant services to Northrop Grumman, Physical Optics Corporation, OE Waves, and multiple other electronics manufacturers for military and commercial applications. Steve holds a Masters in Mechanical Engineering and currently works at JPL performing thermal and structural analyses on space based electronic hardware.
Steve learned the classical techniques for analyzing electronic hardware from Joel Sloan (author Design and Packaging of Electronic Equipment) who was a colleague of Dave Steinberg (author of multiple thermal and vibration analysis books) at Litton Guidance and Control Systems. Steve has expanded the classical techniques to include modern solid modeling and Finite Element Analysis to reduce analysis time, improve accuracy, and decrease product development time.

After registering, you will receive a confirmation email containing information about joining the webinar.
COST: $350 per person, $315 per person if you have five or more from the same company

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Details

Date:
January 18, 2023
Time:
8:30 am - 12:00 pm
Cost:
$350
Event Categories:
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Website:
https://attendee.gotowebinar.com/register/7398629561623085581

Organizer

Sharon Cary
Phone:
303/655-3051
Email:
learn@hobbsengr.com
View Organizer Website