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Webinar: Using Finite Element Analysis with Electronic Equipment: Thermal Cycling, Heat Transfer and Vibration Analysis by Steven Carlson
February 6, 2019 @ 8:30 am - 12:00 pm$350
Using Finite Element Analysis with Electronic Equipment: Thermal Cycling, Heat Transfer and Vibration Analysis by Steve Carlson
Join us for our next webinar! February 6, 2019 8:30 AM-12:00 PM Pacific time (California) Cost $350 per person, Group discounts available!
This 3.5-hour webinar expands on David Steinberg’s techniques and incorporates finite element analysis to determine electronic component junction temperatures and fatigue life due to random vibration and thermal cycling. This webinar is intended for beginners who have not yet had a course in finite element theory. The emphasis is on the engineering reasons to complete a valid finite element analysis. For completeness, it has been necessary to select specific software to illustrate the various stages. Most commercial solid modeling and finite element analysis systems are very similar, and the overlap in their capabilities is probably 90% or more. Solidworks has been selected due to its rapid learning curve and ability to perform most common finite element analysis for electronic hardware. Students will learn the stages of finite element analysis and work multiple examples with Solidworks Simulation and Cosmos/M Geostar. We will Incorporate Professor Steinberg’s methods with FEA techniques to perform heat transfer, random vibration, and thermal cycling analyses.
Steven Carlson has 19 years of extensive experience in defense/aerospace industry dealing with design and analysis of electronic hardware with a strong understanding of thermal and structural analysis. He is the principal engineer at Carlson Mechanical Engineering and has provided mechanical analysis services to Northrop Grumman, Physical Optics Corporation, and multiple other electronic manufacturers for military and commercial applications. Steve holds a Masters in Mechanical Engineering and currently works at Jet Propulsion Laboratory (JPL) performing thermal and structural analyses on space based electronic hardware.
After registering, you will receive a confirmation email containing information about joining the webinar.
COST: $350 per person $315 per person if you have five or more from the same company