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Webinar: Physics of Failure Methods for Building Reliability Into Products by Dr. Abhijit Dasgupta

September 11 @ 8:30 am - 11:30 am

$300

Physics of Failure for Building Reliability Into Products by Dr. Abhijit Dasgupta

Join us for a webinar on September 11, 2019 at 8:30- 11:30 am Pacific time (California) Cost $300 per person, group discounts available!
   Register here!

Webinar Description: This 3-hr course, which costs $300, offers an introductory understanding of some of the key engineering accelerated test techniques needed to develop reliable electronic products. Participants are presented with various physics of failure methods to design and test for reliability.

Participants will….
• Learn how products really fail and understand key reliability issues
• Become acquainted with the failure modes and mechanisms associated with various electronic devices and assemblies
• Determine the stresses associated with the qualification of reliable electronic equipment and examine techniques to address problems of reliability
• Investigate the usage and applicability of reliability standards and handbooks

Webinar Outline:
•   What is reliability ?
•   Why assess reliability ?
•   What reliability metrics make sense ?
•   What is physics of failure ?
•   Failure mechanisms, failure sites and failure modes
•   Lifecycle conditions and how they affect failures
•   PoF process as a proactive way to design & build reliability into a product
•   PoF tools
•   How do the manufacturing process and supply chain affect reliability ?
•   PoF examples
•   Reliability assessment & product qualification with accelerated stress testing
•   Design of accelerated stress tests based on PoF principles
•   PoF Failure acceleration models
Temperature
Moisture and harsh chemical contaminants
Mechanical stresses
Electrical stresses
Combined stresses
•   Case Study:  Example of PoF – based on accelerated stress testing

Instructor Biography: Dr. Abhijit Dasgupta, co-director of CALCE EPRC and faculty member at the University of Maryland, is an expert on physics of failure of electronic assemblies and interconnects and on methods to reduce cycle time for developing and qualifying electronic packaging. He has published widely, organized numerous conferences and workshops, and has served as an associate editor for the ASME Journal of Electronic Packaging.

Cost: $300 per person $270 per person if you have 5 or more from same company

After registering, you will receive a confirmation email containing information about joining the webinar.

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Details

Date:
September 11
Time:
8:30 am - 11:30 am
Cost:
$300
Event Categories:
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Organizer

Sharon Cary
Phone:
303/655-3051
Email:
learn@hobbsengr.com
Website:
hobbsengr.com