Physics of Failure, Electronic and Mechanical Failure Modes and Models by Dr. Alec Feinberg
Join us for a webinar on November 13, 2019 at 8:30 am – 12:30 pm Pacific (California) Cost $400 per person, group discounts available!
Register here!
There are many aspects to the science of physics of failure. In this course we approach the subject by dividing it up into two main sections:
Physics of Failure
- Mechanical Failure Modes & Models
- IC & Electronic Failure Modes & Models
This 4 hour course, which costs $400, is an in-depth approach to physics of failure. It is designed for the engineer who wants a good knowledge base including the state-of-the-art in this area.
The following outline provides an overview for each section
Physics of Failure Introduction
Physics of Failure Tools (Mechanical Failure Modes & Models)
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- Mechanical Plastic Deformation: Elastic deformation, yielding (with vibration) and ductile rupture (with shock) material considerations
- Creep & cumulative creep fatigue material considerations, viscoelastic creep, creep acceleration factor
- Excessive wear; friction & lubrication – types of wear, vibration wear, material selection & hardness, wear acceleration factor
- Cyclic Fatigue: Exact method for damage estimation (derivation using thermodynamic work)
- Miner’s approximation – derivation, why it is an approx., stress concentration
- SN curves – material selection
- Fatigue (SN curves, Basquin’s and Coffin-Manson -high and low cyclic fatigue, Loading Types – stress corrections, Facture Mech. Vibration fatigue, when SN Curves not available)
- PCB fatigue life – Circuit board component fatigue life model analysis –Steinberg Method (sine and random)
- Thermal cycle (strain, fatigue, acceleration factors derivations for Coffin-Manson & Modified, Norris-Landzberg)
Physics of Failure Mechanisms – IC and Electronic Failure Modes and Models
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- Thermal Cycle CTE Mismatch: Failure Modes & thermal fatigue in solder joints
- Engelmaier IPC Solder Joint Life Model, BGAs
- Underfill Modification to Englemaier model
- Temperature: Thermally Activated FMs
- Junction Temperature Modeling
- Voltage Issues: ESD, EOS, TDDB, Dielectric Breakdown
- Dendritic Growth: Ag Migration & Electromigration
- Current Density Issues: Electromigration, Black EM Model, Fusing,
- Circuit trace and wire bond current density limit modeling
- Various failures – HCI, Latch Up, NBTI, Moore’s law issues, General Warnings
- Electrolytic Capacitor: Failure Modes & Life Models
- RoHS Lead Free Solder Issues: Cu Dissolution, Tin Whisker, BGAs
- General Electronic Issues
- Solder Failures: non wetting, grain size, leaching, coverage
- Assembly Errors
- Popcorn Cracking, Voiding Delamination
- Organic contamination
- Electronic Failure modes from shock, vibration
- Diffusion: Substitutional, Kirkendall
- Intermetallics: Au Embrittlement, Purple Plague
- Eight Types of Corrosion: Area effect, and Prevention
About your instructor: Dr. Alec Feinberg is the founder of DfRSoft. He has a Ph.D. in Physics and is the principal author of the books, Design for Reliability (DfR) and Thermodynamic Degradation Science: Physics of Failure, Accelerated Testing, Fatigue, and Reliability Applications. These books are written in an industrial environment, and are very practical. Alec has a logical approach to the DfR processes using a stage gate method since products are develop in these phases. Alec uses this method in his reliability training classes as well found on the DfRSoft website. Alec is also the principal developer for DfRSoftware which is the most thorough reliability tool currently available and is also used to accelerate learning in his training classes. Alec industrial experience has allowed him to provide extensive reliability engineering services in diverse industries (AT&T Bell Labs, TASC, M/A-COM, Tyco Electronics, and Advanced Energy) for over 35 years on solar, thin film power electronics, defense, microelectronics, aerospace, wireless electronics, and automotive electrical systems. He has provided training classes in Design for Reliability & Quality, Shock and Vibration, HALT, Reliability Growth, and Electrostatic Discharge. Alec has presented numerous technical papers and won the 2003 RAMS Alan O. Plait best tutorial award for the topic, “Thermodynamic Reliability Engineering.”
Cost: $400 per person $360 per person if you have 5 or more from same company
After registering, you will receive a confirmation email containing information about joining the webinar.
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