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Two day Webinar Cooling Techniques for Electronic Equipment by Steve Carlson

April 17, 2018 @ 8:30 am - April 18, 2018 @ 12:30 pm

$800

Join us for our next webinar! Cooling Techniques for Electronic Equipment by Steve Carlson

April 17-18, 2018 8:30 am – 12:30 pm Pacific time (California)

Cost $800 per person, group discounts available if you have five or more from same company.

Register here!

This is a two day extensive webinar presented, 4 hours each day.  Attendees must participate in both days.

Don’t wait until your electronic equipment over-heats or fails because of poor cooling. Find out if your present systems are adequately cooled, how to avoid many common cooling problems and how to design efficient, reliable cooling systems for many different types of electronic cabinets. The purpose of this webinar is to show designers and engineers an overview of the quick methods for designing electronic equipment to withstand severe thermal environments without failing. Techniques are presented which will permit the evaluation and design of cost effective, compact cooling systems, without the aid of a large digital computer.

Learn simple design rules, and guidelines, which can improve the effective cooling of your sophisticated electronic components used in today’s military, industrial and commercial electronic systems. Learn methods for determining thermal stresses in lead wires and solder joints due to a mismatch in thermal expansions.

This course is based upon the popular book Cooling Techniques for Electronic Equipment by Mr. Dave Steinberg. Questions are encouraged during the webinar, to make sure each participant understands the design techniques and application presented.

For a complete course description, click here.

WHO SHOULD ATTEND?

R&D Electronic Engineers and Managers, Packaging Engineers, Quality & Reliability Engineers, Test Engineers, Manufacturing Engineers, Mechanical Engineers, Application and Sale Engineers

INSTRUCTOR: Steven Carlson has over 19 years of extensive experience in defense/aerospace industry dealing with design and analysis of electronic hardware with a strong understanding of thermal and structural analysis. He is the principal engineer at Carlson Mechanical Engineering and has provided mechanical analysis services to Northrop Grumman, Physical Optics Corporation, and multiple other electronic manufacturers for military and commercial applications. Steve holds a Masters in Mechanical Engineering and currently works at Jet Propulsion Laboratory (JPL) performing thermal and structural analyses on space based electronic hardware.

Steve learned the classical techniques for analyzing electronic hardware from Joel Sloan (author Design and Packaging of Electronic Equipment) who was a colleague of Dave Steinberg (author of multiple thermal and vibration analysis books) at Litton Guidance and Control Systems. Steve has expanded the classical techniques to include modern solid modeling and Finite Element Analysis to reduce analysis time, improve accuracy, and decrease product development time. He worked under the mentorship of Joel Sloan at Litton Guidance and Control Systems on navigation grade systems (LN-100, LN-200, and LN25x) and development programs (Fiber Optic Gyro and Silicon Accelerometer). Steve has worked on multiple flight programs at JPL including the Mars Science Laboratory and Juno performing heat transfer and vibration analyses on electronic hardware at component and system level.

Cost: $800 per person for both days. If you have five or more from the same company the price is $720 per person

After registering, you will receive a confirmation email containing information about joining the webinar.

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Details

Start:
April 17, 2018 @ 8:30 am
End:
April 18, 2018 @ 12:30 pm
Cost:
$800
Event Categories:
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www.hobbsengr.com

Venue

Webinar

Organizer

Sharon Cary
Phone:
303/655-3051
Email:
learn@hobbsengr.com
View Organizer Website