Preventing Thermal & Vibration Failures in Electronic Equipment Overview by Steven Carlson
Join us for a webinar on April 5, 2023 8:30 am – 11:30 am Pacific time (California)
Cost $300 per person, Group discounts available! Note: This course will be recorded and can be purchased to view at a time more convenient for you. Contact us for more details.
Register here and pass this on to your co-workers!
This 3-hour webinar by Steve Carlson is an overview of his 2-day seminar and will focus on these three topics:
• To understand how variations in coefficients of thermal expansion (CTE) can affect the magnitude of the displacements, forces, and stresses that are developed in electronic assemblies during thermal cycling environments and how these factors affect fatigue life.
• To understand how resonant conditions can affect dynamic displacements, forces and stresses in electronic assemblies during different sine and random vibration environments.
• To understand the concept of “damage accumulation” and how it can be used to determine the approximate fatigue life of various electronic assemblies due to different combinations of fatigue accumulated in thermal cycling and vibration environments.
This course is based upon the popular book Preventing Thermal and Vibration Failures in Electronic Equipment by Prof. Dave Steinberg.
WHO SHOULD ATTEND?
R&D Electronic Engineers and Managers
Packaging Engineers
Quality & Reliability Engineers
Test Engineers
Manufacturing Engineers
Mechanical Engineers
Application and Sale Engineers
INSTRUCTOR: Steven Carlson has over 20 years of extensive experience in defense/aerospace industry dealing with design and analysis of electronic hardware with a strong understanding of thermal and structural analysis. He is a Principal Engineer in Electronic Hardware Thermal / Structural analysis at Jet Propulsion Laboratory. He has provided mechanical analysis consultant services to Northrop Grumman, Physical Optics Corporation, OE Waves, and multiple other electronics manufacturers for military and commercial applications. Steve holds a Masters in Mechanical Engineering and currently works at JPL performing thermal and structural analyses on space based electronic hardware.
Steve learned the classical techniques for analyzing electronic hardware from Joel Sloan (author Design and Packaging of Electronic Equipment) who was a colleague of Dave Steinberg (author of multiple thermal and vibration analysis books) at Litton Guidance and Control Systems. Steve has expanded the classical techniques to include modern solid modeling and Finite Element Analysis to reduce analysis time, improve accuracy, and decrease product development time.
Cost: $300 per person, if you have five or more from the same company the price is $270 per person
After registering, you will receive a confirmation email containing information about joining the webinar.
View System Requirements
