Preventing Thermal & Vibration Failures in Electronic Equipment by Steven Carlson
Join us for a webinar on October 24, 2018 8:30 am – 11:30 am Pacific time (California)
Cost $300 per person, group discounts available if you have five or more from same company.
Register here! Pass this on to your co-workers!
This 3-hour webinar by Steve Carlson, which costs $300, is an overview of his 2-day seminar and will focus on these three topics:
• To understand how variations in coefficients of thermal expansion (CTE) can affect the magnitude of the displacements, forces, and stresses that are developed in electronic assemblies during thermal cycling environments and how these factors affect fatigue life.
• To understand how resonant conditions can affect dynamic displacements, forces and stresses in electronic assemblies during different sine and random vibration environments.
• To understand the concept of “damage accumulation” and how it can be used to determine the approximate fatigue life of various electronic assemblies due to different combinations of fatigue accumulated in thermal cycling and vibration environments.
This course is based upon the popular book Preventing Thermal and Vibration Failures in Electronic Equipment by Prof. Dave Steinberg.
WHO SHOULD ATTEND?
R&D Electronic Engineers and Managers
Packaging Engineers
Quality & Reliability Engineers
Test Engineers
Manufacturing Engineers
Mechanical Engineers
Application and Sale Engineers
INSTRUCTOR: Steven Carlson has over 19 years of extensive experience in defense/aerospace industry dealing with design and analysis of electronic hardware with a strong understanding of thermal and structural analysis. He is the principal engineer at Carlson Mechanical Engineering and has provided mechanical analysis services to Northrop Grumman, Physical Optics Corporation, and multiple other electronic manufacturers for military and commercial applications. Steve holds a Masters in Mechanical Engineering and currently works at Jet Propulsion Laboratory (JPL) performing thermal and structural analyses on space based electronic hardware.
Steve learned the classical techniques for analyzing electronic hardware from Joel Sloan (author Design and Packaging of Electronic Equipment) who was a colleague of Dave Steinberg (author of multiple thermal and vibration analysis books) at Litton Guidance and Control Systems. Steve has expanded the classical techniques to include modern solid modeling and Finite Element Analysis to reduce analysis time, improve accuracy, and decrease product development time.
He worked under the mentorship of Joel Sloan at Litton Guidance and Control Systems on navigation grade systems (LN-100, LN-200, and LN25x) and development programs (Fiber Optic Gyro and Silicon Accelerometer). Steve has worked on multiple flight programs at JPL including the Mars Science Laboratory and Juno performing heat transfer and vibration analyses on electronic hardware at component and system level.
Cost: $300 per person, if you have five or more from the same company the price is $270 per person
After registering, you will receive a confirmation email containing information about joining the webinar.
View System Requirements
This webinar will be recorded. To purchase the link for this course contact with the link above or call 303 655 3051
