Webinar: eWorkmanship Standards for Advanced Hybrids, ICs and Microwave Assemblies by Tom Green

eWorkmanship Standards for Advanced Hybrids, ICs and Microwave Assemblies by Tom Green 

Join us for a new webinar on Thursday July 27, 2017 8:30 – 11:30 AM Pacific time  3 hours   Cost $300  Group discounts available!

Register here!

Next generation Hybrids, Microcircuits, IMAs (Integrated Microwave Assemblies) and chip and wire PCBs all require workmanship standards and visual inspection just prior to encapsulation or hermetic seal in order to meet to meet stringent reliability predictions and expected lifetimes in a harsh environment. This is a critical process step that requires a high degree of skill and understanding of what to look for and reject as part of the inspection process. This tutorial defines the inspection criteria based on traditional Mil-Std-883 requirements in conjunction with industry accepted best commercial practices. High Mag inspection of ICs, MMICs and diodes along with Low mag die attach, wirebond and assembly related defects are reviewed in detail. Each student receives a 30 day access to the Workmanship Standards eBook: Hybrids, Microcircuits and RF/MMIC modules, an online illustrated guide depicting photos of common workmanship defects as seen during production and each defect slide is tied to a particular page and referenced requirement in MIL-STD-883/750. The students are exposed to a variety of defects and how the defects relate to the materials and process flow. Students learn what to look for as part of visual inspection and how to interpret and apply the very latest mil spec visual inspection criteria. The course is intended for quality and process engineers, inspectors, lead operators and others responsible for inspection of the hardware prior to the final package sealing process. Designers and quality managers would also benefit from understanding the critical importance of visual inspection and its impact on reliability of the finished product. Mr. Thomas Green is the principle at TJ Green Associates LLC (www.tjgreenllc.com), a veteran owned small business focused on training and consulting for military, space and medical microelectronic devices. He teaches a variety of microelectronics packaging courses around the globe and in plant at major corporations and consults for a variety of companies in the military/industrial and medical device industries. He has thirty five years of experience in microelectronics working at positions in industry, academia and government. Tom has demonstrated expertise in die attach, wirebond, visual inspection, failure analysis, hermetic seal and leak testing processes. Tom is an active IMAPS member and Society Fellow. He has a B.S. in Materials Engineering from Lehigh University and a Masters from the University of Utah.

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