4 half-day Webinar: Design for Reliability and Quality by Dr. Alec Feinberg

Design for Reliability by Dr. Alec Feinberg 

Join us for this 4 half-day webinar August 16-17 23-24, 2022 8:30 am-12:00 pm Pacific time 3.5 hours each day, 14 hrs total.  Cost $950 per person. Group discounts available! Attendees must participate in all 4 days.  This course will be recorded and can be purchased to view at a time more convenient for you.  Contact us for details. Discounted optional software available.

Register here and pass this on to your colleagues!  Register once for all 4 days

Course outline:

PART 1: BASIC METHODS IN RELIABILITY & QUALITY

1. Reliability & Quality in Today’s Marketplace: ○ A Practical Approach to Reliability Implementation ○ Reliability Growth and ROI ○  Reliability as a Differentiator  ○ The Main Components of a DfRQ Company Program
2. The Stage Gate Approach: ○ Idea, Evaluate, Development, Transition, Production ○ Understanding Each Gate – The Tools for your Program  ○ Piecing it Together – A Value Added Reliability Program
3. Basic Reliability Mathematics: (Using DfRSoft Tools)   ○ MTBF/Failure Rate Basics ○ Failure Rate Conversion (FITs, FMH, MTBF, PPM, AFR, %Failure) ○ System Reliability Analysis & Block Diagrams (Series, Parallel, Redundancy for K of N, Active/Standbys)

PART 2: DEMONSTRATING & ANALYZING RELIABILITY

4. Top Down FMEA for Reliability Program Planning: ○ What is a Top Down FMEA ○ Top Down FMEA for Program Planning ○  Team Approach ○ Design Controls & Recommended Actions ○ How to Make a Program Plan with Top Down Example ○ Value of Derating (Derating Specs – DfRSoft Guideline)
5. Bottoms Up Design FMEA: ○ Key to a Good DFMEA ○ Most Efficient DFMEA

6. Design Assessment Reliability Testing & Reliability Growth (DART – HALT)    ○ Finding Failure Modes – Test to Fail Not to Pass ○ Accelerated Reliability Growth    ○ Test Design by Failure Modes ○ HALT ○ Design Margin – Load-Stress Reliability Interference Assessment ○ Electrical Derating
7. Advanced Reliability Mathematics: ○ Time Dependent Failure Rate ○ Main Distribution of the Bathtub Curve, Weibull, Exponential, and Lognormal○ Introduction to Reliability Plotting Using Software
8. Accelerated Life Models & Environmental Profiling:○ Acceleration Factors & Models (Temperature-Arrhenius, Coffin-Manson Temperature Cycle, Vibration Accelerated Models) ○ Chi-squared confidence method for accelerated testing ○ Environmental Profiling (model for environments with varying stress profiles)
9. Design Maturity Chi-Squared Demonstration Testing: ○ Testing for a Reliability Failure Rate Objective? ○ Accelerated Test Plan Examples ○ Statistical Confidence Test Plans
10. Reliability Monitoring and Screening: ○ Screening vs. Monitoring ○ Common Screens and Monitoring Testsv○ HASS Screening
11. Field Returns and Device Hours: ○ Device Hours – Multiple Test Uses and Field Returns ○ AFR – Most common company metric ○ Field Return– Raw Data Analysis
12. Availability & Sparing

PART 3 SPECIAL TOPICS TAYLORED TO THE CLASS’ NEEDS

13. Advanced CDM ESD Concepts: ○ Introduction CDM compared to HBM ○ Why Ionizers can be important ○ ESD versus EOS damage ○ CDM Case Studies ○ Advanced Audits/Investigation, Test Fixtures

14. Shock & Vibration (Numerous Exercises) ○ Understanding Gs & gs ○ Vibration testing for Shipping
15. Physics of Failure 7 Step Problem Solving
16. Physics of Failure Analysis Tools ○ SEM (FE-SEM, EDS) ○ Digital Microscopy ○ Real Time Radiology, X-Ray Maps ○ Thermal Imaging ○ FTIR
17. Physics of Failure ○ Four main types of aging ○ Diffusion – Substitutional, Kirkendall ○ Intermetallics – Au Embrittlement, Purple Plague ○ Bond wire failures – non stick, intermetallic ○ Dendritic Growth, Ag Migration & Electromigration ○ CTE’s Mismatch, Thermal Fatigue ○ Engelmaier IPC Solder Joint Life Model, BGAs ○ Electronic Failure modes from shock, vibration ○ Creep, Solder Creep, Creep Resistance in Plastics ○ Organic contamination ○ Popcorn Cracking, Voiding Delamination ○ Assembly Errors ○ Solder Failures (non wetting, grain size, leaching, coverage) ○ Contamination – Solder non-wetting, Epoxy non-stick ○ Plating Contamination ○ RoHS Lead Free Solder Issues ○ Cu Dissolution ○ PCB Finishes ○ ESD & EOS – Dielectric Breakdown ○ Current Density & Fusing of Bond wires and wires ○ Junction Temperature Issues & Modeling

18. Putting it all Together

19. Homework with Solutions

Dr. Alec Feinberg is the founder of DfRSoft. He has a Ph.D. in Physics and is the principal author of the book, Design for Reliability.  Alec has provided reliability engineering services in all areas of reliability and on numerous products in diverse industries that include solar, thin film power electronics, defense, microelectronics, aerospace, wireless electronics, and automotive electrical systems.  He has provided training classes in Design for Reliability & Quality, Shock and Vibration, HALT, Reliability Growth, Electrostatic Discharge, Dielectric Breakdown, DFMEA and Thermodynamic Reliability Engineering.  Alec has presented numerous technical papers and won the 2003 RAMS Alan O. Plait best tutorial award for the topic, “Thermodynamic Reliability Engineering.  Alec’s newest book is now in its second edition, Physics of Failure Degradation Science: with Vibration, Thermal Fatigue, Accelerated Testing, and Reliability Applications (2020).

Cost $950 per person for all four days. $855 per person if you have five or more from the same company.

Bonus: Attendees participating in this course have the option to purchase Dr. Feinberg’s full license DFRSoft software for $200, which is 50% off the regular price. This world class software (Excel type format) includes full Weibull Analysis (with MLE), Accelerated Factors, Accelerated sample size planning and analysis, Field returns, Derating, BGA Fatigue life, Shock and Vibration, Thermal analysis, Physics of failure, SPC and lot sampling plans, Environmental profiling, and more. Most of this software is used in the course so it is easy to see how it is used. It is the world’s only complete reliability software.

After registering, you will receive a confirmation email containing information about joining the webinar.

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