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Webinar: Printed Circuit Board Modeling: A Critical Step in Evaluating Electronic Assembly Reliability Through Accurate Material Properties by Dr. Jean-Baptiste Libot
Printed Circuit Board Modeling: A Critical Step in Evaluating Electronic Assembly Reliability Through Accurate Material Properties by Dr. Jean-Baptiste Libot
Join us for our next webinar! April 29, 2026 8:30 – 10:30 AM Pacific time (California) Cost $200 per person, Group discounts available! Please note, this webinar will be recorded. If the time is not convenient for you, this webinar can be purchased to view at your leisure. Contact us for more details.
Register here and pass this on to your co-workers!
Course Description:
Printed Circuit Boards (PCBs) are laminated structures made of conductive copper layers and insulating layers, known as laminates and prepregs. These insulating layers are composite materials with an organic matrix, usually epoxy resin, reinforced with fiberglass fabrics. PCBs provide both mechanical support and electrical interconnection for soldered electronic components, and they play a crucial role in the reliability of electronic assemblies exposed to harsh thermomechanical environments as well as mechanical stresses such as vibrations and shocks. Therefore, in electronic equipment design, understanding the physical properties of PCBs is essential for assessing assembly reliability, which in turn requires the development of suitable computational models. This webinar presents a methodology for evaluating the physical properties of multilayer PCBs, using a Representative Volume Element (RVE) for the laminates and prepregs, and a Representative Copper Layer (RCL) for the conductive layers. It provides the foundation for determining key PCB properties, including density, Young’s modulus, Coefficient of Thermal Expansion (CTE), flexural modulus, thermal conductivity, and specific heat. The models are based on continuum mechanics, strength of materials theory, and classical laminate theory, and are validated with experimental results across different PCB stackups. Attendees will learn from practical examples how PCB stack-up affects electronic assembly reliability. This webinar offers engineers and electronic designers a set of practical models to help ensure the reliability of their equipment.
About your instructor:
Dr. Jean-Baptiste Libot is an Electronic Assembly Expert with over 12 years of experience in the aerospace and defense industry. He began his career at Airbus Group, where he worked as a visiting researcher at the Center for Advanced Life Cycle Engineering (CALCE) within the Electronic Products and Systems (EPS) Consortium. He then joined Safran Electronics and Defense, focusing on the reliability assessment of lead-free electronic boards subjected to thermal cycles and vibrations. Jean-Baptiste is the co-founder of Hooke Electronics (France), where he develops thermomechanical and mechanical fatigue models to assess the reliability of lead-free electronic assemblies for clients across the electronics industry. He also provides training programs and develops numerical tools to support engineers and designers in developing reliable electronic equipment. He holds a French “Diplôme d’Ingénieur” in Materials Science (equivalent to a Master of Science) in Materials Science and a Research Master’s degree in Materials, Nanomaterials, and Multi-Materials Science from the National Polytechnic Institute of Toulouse, France. He earned his PhD jointly from the National Polytechnic Institute of Toulouse and Safran Electronics & Defense, for which he was awarded the 2018 Aerospace Valley PhD Thesis Award. Jean-Baptiste has published over 10 technical papers and was awarded the SMTA Best of Proceedings Award in 2024.
Cost: $200 per person, if you have five or more from the same company the price is $180 per person
After registering, you will receive a confirmation email containing information about joining the webinar. NOTE: if you do not receive the confirmation email, please call us at 303-655-3051