Professor Bernstein completed his Ph.D from MIT in 1990. Afterwards, he started his reliability research career at MIT Lincoln Laboratories and joined the faculty of University of Maryland to teach in the Reliability program. His expertise lies in several areas of micro and macro electronic device reliability and physics of failure research including packaging, system reliability modeling, gate oxide integrity, radiation effects, MEMS and laser programmable metal interconnect. He directs the Laboratory for Reliable Integrated Electronics. This Laboratory is a center of research activity dedicated to serving the needs of manufacturers of highly reliable electronic systems using commercially available off the shelf parts. Research areas include thermal, mechanical, and electrical interactions of failure mechanisms of ultra-thin gate dielectrics, next generation metallization and power devices. He also works extensively with the semiconductor industry on projects relating to laser processing for defect avoidance, programmable interconnect used in Field Programmable Analog Arrays and repair in microelectronic circuits and packaging. Professor Bernstein was a Fulbright Senior Researcher/Lecturer at Tel Aviv University in the Department of Electrical Engineering, Physical Electronics. Professor Bernstein is a senior member of IEEE.Professor Bernstein has authored several books on reliability. His latest, entitled: Reliability Prediction from Burn-In Data Fit to Reliability Models (Elsevier Academic Press, 2014) is the basis for his combination of failure mechanisms theory. He works extensively with military standards on Aerospace and Satellite reliability using off-the-shelf parts. He has research contracts with the US Navy and Air Force. Professor Bernstein has successfully implemented reliability programs that improves mean time-to-fail (MTTF) and can successfully apply algorithms that will actually predict reliability based on accelerated tests. He has expertise also in burn-in and failure analysis. He has also developed software implementation of the Multiple Failure Mechanism model for reliability simulation and prediction with BQR Software. They expect to deliver the first complete reliability simulation package by January 2014. This software will implement reliability calculations for advanced CMOS and semiconductor devices as a module in their FixStress Software package.