Using Finite Element Analysis with Electronic Equipment: Thermal Cycling, Heat Transfer and Vibration Analysis by Steve Carlson – $350 per person 3.5 hrs
This 3.5-hour webinar, which costs $350, expands on David Steinberg’s techniques and incorporates finite element analysis to determine electronic component junction temperatures and fatigue life due to random vibration and thermal cycling. This webinar is intended for beginners who have not yet had a course in finite element theory. The emphasis is on the engineering reasons to complete a valid finite element analysis. For completeness, it has been necessary to select specific software to illustrate the various stages. Most commercial solid modeling and finite element analysis systems are very similar, and the overlap in their capabilities is probably 90% or more. Solidworks has been selected due to its rapid learning curve and ability to perform most common finite element analysis for electronic hardware. Students will learn the stages of finite element analysis and work multiple examples with Solidworks Simulation and Cosmos/M Geostar. We will incorporate Professor Steinberg’s methods with FEA techniques to perform heat transfer, random vibration, and thermal cycling analyses. Questions are encouraged during the Webinar!
Who should attend: R&D Electronic Engineers and Managers • Packaging Engineers • Quality & Reliability Engineers • Test Engineers • Manufacturing Engineers • Mechanical Engineers • Application & Sale Engineers
FINITE ELEMENT ANALYSIS WITH ELECTRONIC EQUIPMENT
- Incorporating Finite Element Analysis
- “How to” Thermal / Structural analysis flowcharts STAGES OF FINITE ELEMENT ANALYSIS
- Construction of parts in Solid Modeler
- Defeature solid model to improve meshing
- Combining multiple parts into an assembly
- Selecting Element Type
- Mesh the part or assembly
- Assigning material to each part
- Creating regions of the part to be loaded; Assigning levels and type
- Defining the model restraints
- Solving the linear system
- Post-process and evaluating the results
- Determine failure criterion
- Document, report, and file the study
SOLIDWORKS SIMULATION WITH ELECTRONIC EQUIPMENT
- Studies
o Drop Test – Effect of dropping the assembly on a rigid floor
o Modal Analysis – Resonant frequencies
o Dynamic Analysis – Harmonic, Random Vibration
o Fatigue – Number of cycles required for failure due to material S-N curve
o Modal Time History – Time based dynamic analysis
o Static – Constant acceleration
o Thermal – Steady-State and Transient
- Element Types
- Modeling Errors
CONSTRUCTING FINITE ELEMENT MODEL
- Split lines and bodies
- Mesh control
- Nodal singularity
- Restraints – Fixed vs. Simple Support
REAL WORLD EXAMPLES CIRCUIT CARD THERMAL ANALYIS
- Defeature system solid model using Solidworks.
- Apply boundary conditions and power dissipation in Solidworks Simulation
- Determine circuit card interface rail temperature with wedgelock contact resistance
- Construct circuit card using Cosmos/M Geostar layer by layer per Gerber data
- Apply component heat power / rail temperature
- Extracting board temperature and using spreadsheet to calculate junction temperature
CIRCUIT CARD COMPONENT FATIGUE LIFE DUE TO RANDOM VIBRATION
- Construct structural model chassis with wedge lock retained PCB
- Determine effective PCB flexural modulus of elasticity due to Copper / Dielectric layering
- Apply material properties and boundary conditions including random vibration curve
- Extract PCB deflection from FEA and use spreadsheet to determine Miner’s Cumulative Damage Index using three band technique to calculate fatigue life
THERMAL EXPANSION ANALYSIS OF GLASS BODY DIODE
- Solid model of diode soldered to PCB
- Determined maximum solder shear stress over temperature
- Solder joint fatigue life determined for thermal cycling
Steve Carlson is a Principal Engineer at Jet Propulsion Laboratory performing thermal and structural analyses on space based electronic hardware. He received his BSME at Arizona State University and MSME at California State University Northridge and has expanded the classical techniques developed by Mr. Dave Steinberg to include Solid Modeling and Finite Element Analysis to reduce analysis time, improve accuracy, and decrease product development time. He has worked on the mechanical design, analysis, testing and packaging of cost effective sophisticated electronic equipment that must work with a high degree of reliability in harsh thermal, thermal cycling, vibration and shock environments. He has been involved in these areas related to commercial, industrial and military applications for many years. He has provided consultant services to multiple companies in the areas of heat transfer, sine/random vibration, and computational fluid dynamics. Mr. Carlson has worked on many aircraft, missile, and space programs for Litton G&CS, Northrop Grumman, and JPL. These include the F-14, F-15, F-16, F-22, cruise missile, AMRAAM, multiple Mars missions, and many LOE and interplanetary satellites.
To purchase this webinar contact with link below or call 303 655 3051.
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