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Lead-Free Solder Joint Reliability-Back to the Basics by Dr. Jean-Paul Clech  Cost $400 per person  4 hours Group discounts available! 10/25/2023

NEW material covered in this webinar: Predictive life models and thermal cycling acceleration factors for SAC105, SAC205, SAC305 and SAC405 solder compositions.

Given the proliferation of lead-free solder alloys, and the dearth of lead-free reliability data and modeling tools, taking care of the basics is of utmost importance to designers and product engineers having to build in long-term solder joint reliability. This webinar reviews basic board, component and board assembly parameters that effect solder joint reliability regardless of solder composition, tin-lead or lead-free. Rules-of-thumb and design-for-reliability guidelines are presented that are of help to improve solder joint life under both thermal and mechanical loading conditions. Accelerated testing procedures and acceleration factors are also discussed. This introductory webinar will be of interest to beginners as well as experienced technical staff needing a refresher on designing for solder joint reliability in electronic assemblies.

This webinar is introductory in nature with emphasis on board and component effect and generic guidelines that can be used to minimize the risk of solder joint failures in circuit board assemblies. While the webinar ends with an overview of lead-free solder joint reliability trends, solder alloy specifics are not covered. Numerous rules-of-thumb (do’s and don’ts) are presented based on established industry practices and field failures encountered by the instructor.

About your instructor: Jean-Paul Clech has 35+ years of practical experience in SMT design, soldering quality and reliability assurance. He maintains one of the largest databases of solder joint reliability data, material properties and life prediction models in the industry and is constantly challenged by problems brought about by new and emerging technologies.

Jean-Paul is the founder of EPSI Inc. in Montclair, NJ, where his responsibilities include technical consultation and problem solving for clients across the electronics industry, and the development of engineering tools and training programs to prevent or solve reliability problems in electronic packages and board assemblies.

Jean-Paul previously was a Member of the Technical Staff and then consultant at AT&T Bell Laboratories.  He received the Diplôme d ‘Ingénieur from Ecole Centrale de Paris, France (Materials Science major), and the M.S. and Ph.D. degrees in Mechanical Engineering from Northwestern University, Evanston, IL.  He is the author of over forty technical papers, a frequent speaker at technical conferences, and has been an invited lecturer and instructor at various corporate events and professional venues in Asia, Europe and North America.  He is an active member of ASME, IEEE, IMAPS, TMS and SMTA.  In 2003, Jean-Paul received the SMTA Member of Distinction award.  In 2006, he was presented with the IPC’s Distinguished Committee Service award in appreciation and recognition of his contribution to the development of IPC-9701A, Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments. In 2009, Jean-Paul and his co-authors from Hewlett-Packard received a best paper award at the SMTA International Conference.

To purchase this webinar contact with link above or call 303 655 3051.