Physics Of FailureInstructor: Abhijit Dasgupta, Ph.D. - 2 Day Seminar
Why Do Electronics Really Fail?
Do the Old Standards Do the Job?
The Physics of Failure Approach
Stress Analysis Approaches
Ball Grid Array Interconnect Reliability
Vias and PTHs
Conductive Filament Formation
Wire Bond Failures in Glob-Top Chip-On-Board Packages
PoF Approach for Accelerated Qualification
The 5-Step Approach for Accelerated Life Testing
Virtual Qualification and Stress Margins
Testing and Data Post-Processing
Thermal & Power Cycling
Vibration and Mechanical Shock
Combined Thermal Cycling and Vibration
Combined Temperature and Humidity
The PoF Approach for Process Verification Testing
Types of Screens:
Accelerated Wearout Screens
The two-step approach for Screening
This course offers an introductory understanding of some of the key engineering accelerated test techniques needed to develop reliable electronic products. Participants are presented with various physics of failure methods to design and test for reliability.
Participants will . . .
· Learn how products really fail and understand key reliability issues
· Become acquainted with the failure modes and mechanisms associated with various electronic devices and assemblies Determine the stresses associated with the qualification of reliable electronic equipment and examine techniques to address problems of reliability
· Investigate the usage and applicability of reliability standards and handbooks
WHO SHOULD ATTEND
This course is intended for those who are involved in the design, analysis, material selection, manufacture and test of microelectronic components, printed circuit/wiring boards and assemblies. Participants will receive an understanding of the various reliability tradeoffs in electronic packaging.
Two-Day Course: 1,195 (U.S. Dollars) – Payment is due by seminar date. We accept VISA, MasterCard or American Express.
Register through our website or via e-mail: email@example.com
Dr. Abhijit Dasgupta, Professor of Mechanical Engineering at the University of Maryland, has conducted over 20 years of research on Physics of Failure (PoF) approaches for developing reliable, complex multi-functional systems that perform electronic, photonic, and mechanical functions. This research, sponsored by a consortium of leading electronics builders/users at the Center for Advanced Life Cycle Engineering (CALCE), focuses on industry-relevant projects in reliability assurance of electronic systems, MEMS, sensors, actuators, and ‘smart’ composite systems. Examples include avoidance of failures caused by thermal and power cycling, multi-DoF vibration, shock/drop, combined stresses. He applies these PoF principles to develop effective virtual qualification tools, for optimizing manufacturing process windows, for real-time health monitoring and prognostics, and for devising quantitative accelerated testing strategies used in qualification and quality assurance of complex electronic and electromechanical systems. He has consulted for many major electronics manufacturers, published over 250 journal articles and conference papers on these topics, presented over 35 short workshops nationally and internationally, served on the editorial boards of three different international journals, organized several national and international conferences, and received seven awards for his contributions in materials engineering research and education. He has critically evaluated the use of HALT/HASS test methods and has presented PoF seminars and workshops at Hobbs Engineering over the past 15 years.